University of Colorado - Boulder - Wafer-Level Sub-Module Integrated DC/DC Converter CX(s) Applied: A9, B3.6 Date: 11/30/2011 Location(s): Colorado, Maine, Virginia Offices(s): Advanced Research Projects Agency-Energy
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November 30, 2011
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University of Colorado - Boulder - Wafer-Level Sub-Module Integrated DC/DC Converter
CX(s) Applied: A9, B3.6
Date: 11/30/2011
Location(s): Colorado, Maine, Virginia
Offices(s): Advanced Research Projects Agency-Energy
Funding will support development of a planar, wafer-level sub-module integrated converter (SubMIC) device that can be integrated into various types of photovoltaic (PV) modules to enable low-cost maximum power point tracking at high power processing efficiencies.
CX(s) Applied: A9, B3.6
Date: 11/30/2011
Location(s): Colorado, Maine, Virginia
Offices(s): Advanced Research Projects Agency-Energy
Funding will support development of a planar, wafer-level sub-module integrated converter (SubMIC) device that can be integrated into various types of photovoltaic (PV) modules to enable low-cost maximum power point tracking at high power processing efficiencies.